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Cooler Master CryoNamics, Thermal pad, 2.8 g/cm³, Grey, 0.07 °C/W, -40 - 125 °C, 30 mm
Item no.: [21733361] | Manufacturer: Cooler Master | Model no.: TPY-ADPG-3040-R1 | EAN: 4719512147924
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Introducing Cooler Master’s thermal pads, CRYONAMICS, our latest innovation in cooling technology. Our thermal pads have been optimally designed for a range of applications from CPUs, GPUs, and RAM to modular cooling, TVs, and cars. CRYONAMICS are constructed with a unique phase change material to provide the best possible heat dissipation. With additional features such as being silicon-free, exhibiting extremely low thermal resistance, easy application, and high reliability, CRYONAMICS represents a new high mark to hit for the industry.
PHASE CHANGE MATERIAL
A phase change material is implemented to fill in gaps in the product’s construction, thereby improving heat dissipation. When its reaching to certain degree, the material becomes paste form to moisten the surface so air is being cleared, the thermal resistance is lowered to let the heat out.
SILICON-FREE
No silicon materials have been used in the manufacturing of our thermal pads which is safer for your devices.
EXTREMELY LOW THERMAL RESISTANCE
Comparing to traditional thermal pad, phase change material could fill in the gap much better between the interface, A new height of performance has been reached by achieving a hyper-low thermal resistance
Easy-to-apply
Our thermal pads have been designed with users in mind, and thus implement a straightforward application method. It is recommended to stick on to your cooler’s base and then install it to your CPU or GPU.
PHASE CHANGE MATERIAL
A phase change material is implemented to fill in gaps in the product’s construction, thereby improving heat dissipation. When its reaching to certain degree, the material becomes paste form to moisten the surface so air is being cleared, the thermal resistance is lowered to let the heat out.
SILICON-FREE
No silicon materials have been used in the manufacturing of our thermal pads which is safer for your devices.
EXTREMELY LOW THERMAL RESISTANCE
Comparing to traditional thermal pad, phase change material could fill in the gap much better between the interface, A new height of performance has been reached by achieving a hyper-low thermal resistance
Easy-to-apply
Our thermal pads have been designed with users in mind, and thus implement a straightforward application method. It is recommended to stick on to your cooler’s base and then install it to your CPU or GPU.