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HP AMD Opteron 6272, AMD Opteron, Socket G34, 32 nm, Tray, 2.1 GHz, 64-bit
Item no.: [990461] | Manufacturer: HP | Model no.: 655090-B21
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In stock, order before 3 PM and we ship today (weekdays) More info
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Shipping @price - GLS
12,00
EUR
266,21
Incl. VAT 332,76
Total incl. delivery
347,76
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AMD proudly presents the AMD Opteron™ 6200 Series—the world’s first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability.
Performance
AMD has designed several new features, including AMD Turbo CORE technology and Flex FP, into its processors so that datacenters can maximize their performance potential.
AMD-P
New additions to the AMD-P suite of energy-efficient technologies like TDP Power Cap and the C6 power state helps customers maximize the performance per watt in their datacenter and can help lower power and cooling costs.
Direct Connect Architecture 2.0
HyperTransport™ 3.0 Technology (HT3) enables outstanding interconnect speeds between cores, cache and quad-memory channels supporting up to 1600MHz DDR3 memory.
The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability.
Performance
AMD has designed several new features, including AMD Turbo CORE technology and Flex FP, into its processors so that datacenters can maximize their performance potential.
AMD-P
New additions to the AMD-P suite of energy-efficient technologies like TDP Power Cap and the C6 power state helps customers maximize the performance per watt in their datacenter and can help lower power and cooling costs.
Direct Connect Architecture 2.0
HyperTransport™ 3.0 Technology (HT3) enables outstanding interconnect speeds between cores, cache and quad-memory channels supporting up to 1600MHz DDR3 memory.